Allegro Miniaturization Option

Constraint-Driven HDI Design Flow with BGA pin pitches decreasing to below 1mm-0.8mm or lower with 0.65 or 0.5mm pin pitches-users are forced to implement a buildup PCB technology using high-density interconnect (HDI).

While miniaturization is not necessarily the primary objective in many market segments, the move to buildup technology is necessary for fanning out a BGA- particularly if it has three or four rows of pins on each side. The Allegro PCB Designer through its Miniaturization Option offers a proven constraint-driven HDI design flow with a comprehensive set of design rules for all different styles of HDI designs, from a hybrid buildup/core combination to a complete buildup process like ALIVH. In addition, it includes automation for adding HDI to shorten the time to create designs that are correct-by-construction. 

 

Embedded Components
Reducing end product size can be accomplished in many different ways. One of the approaches PCB designers are taking is to embed packaged components on inner layers. Allegro PCB Designer through its Miniaturization Option offers constraintdriven embedded component placement and routing. It supports traditional directattach as well as new indirect-attach techniques. Additionally it offers the ability to create and manage cavities on layers specified for embedding components.

Allegro Miniaturization Option

 

Highlights:

  • Constraint Manager: HDI rule set
  • Micro-via and associated spacing, stacking, and via-in-pad rules
  • Constraint-driven HDI design flow
  • Manufacturing rule support for embedding components
  • Embedd components on inner layers
  • HDI micro-via stack editing
  • Dynamic shape-based filleting, line fattening, and trace filleting
  • Hug contour routing (Flex)
  • Support for cavities on inner layers

 

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