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While miniaturization is not necessarily the primary objective in many market segments, the move to buildup technology is necessary for fanning out a BGA- particularly if it has three or four rows of pins on each side. The Allegro PCB Designer through its Miniaturization Option offers a proven constraint-driven HDI design flow with a comprehensive set of design rules for all different styles of HDI designs, from a hybrid buildup/core combination to a complete buildup process like ALIVH. In addition, it includes automation for adding HDI to shorten the time to create designs that are correct-by-construction.
Embedded Components
Reducing end product size can be accomplished in many different ways. One of the approaches PCB designers are taking is to embed packaged components on inner layers. Allegro PCB Designer through its Miniaturization Option offers constraintdriven embedded component placement and routing. It supports traditional directattach as well as new indirect-attach techniques. Additionally it offers the ability to create and manage cavities on layers specified for embedding components.

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